Industry leaders, technology experts, policymakers and sustainability advocates recently gathered at the 6th International Summit for the Packaging Industry, organised by the Indian Institute of Packaging (IIP), to deliberate on the future of packaging under the theme ‘Packaging 5S–AI’. The summit brought together key stakeholders from across the packaging value chain to explore innovations, sustainability imperatives, and the role of emerging technologies such as Artificial Intelligence in shaping the next generation of packaging solutions.
AI And Circularity In Focus At 6th International Summit For Packaging Industry
At the 6th IIP Packaging Summit, experts discussed AI-driven, sustainable packaging. UFlex’s Jeevaraj Pillai stressed circular design, recyclability (“whatever is extrudable is recyclable”), and collaboration to create safe, smart, sustainable packaging.
In a keynote address at the summit, Mr. Jeevaraj Pillai, Whole Time Director, President – Flexible Packaging and New Product Development, and Director – Sustainability, UFlex Limited, spoke about the evolving role of packaging in advancing sustainability and supporting a circular economy.
Highlighting the importance of innovation aligned with responsibility, Mr. Pillai emphasised that the future of packaging lies in designing materials and solutions that support circularity while continuing to meet the functional requirements of product protection, safety, and shelf life. He noted that packaging innovation must move beyond incremental improvements and focus on developing structures that are compatible with existing recycling systems.
Reinforcing the industry’s progress in this direction, Mr. Pillai remarked, “Whatever is extrudable is recyclable,” underlining that materials capable of being reprocessed through extrusion can be recycled back into films and other products. He explained that this principle is central to advancing true circularity in flexible packaging, where materials are designed not only for performance but also for recyclability.
Mr. Pillai also highlighted the need for stronger collaboration across the packaging ecosystem—from material producers and converters to brand owners and policymakers—to accelerate the transition towards sustainable packaging solutions that reduce waste while supporting efficient resource use.
The summit, themed ‘Packaging 5S–AI’, focused on advancing packaging that is Safe, Secure, Standardized, Smart, and Sustainable, while exploring the role of emerging technologies such as Artificial Intelligence (AI) in addressing evolving sustainability and regulatory expectations within the industry.
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